PCBA defluxing with Co-solvent process from INVENTEC

Demo video describing generalities of Co-solvent cleaning using Topklean EL20A (as cosolvent) and 3M Novec 71IPA in Vapour Phase machine for PCBA defluxing (cleaning of baked on flux residues) filmed at Inventec Bry Sur Marne


EEVblog #517 – Car Airbag Controller Teardown

What’s inside a modern car airbag controller?
This is is from TRW and comes from a late model Hyundai.

Forum: http://www.eevblog.com/forum/blog/eevblog-517-car-airbag-controller-teardown/


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IoT, Automobile Electronics Motivating FPCB Industry Development

Flexible Printed Circuit Boards Market report, created by Allied Surveys, estimates that the world-wide market is likely to gather 27 billion by the year 2022, thriving at a CAGR of 10.4Per-cent from 2016 To 2022.

Asia-Pacific led the worldwide market, for revenue, accounting for in excess of 46% in 2015, followed by North America.

FPCBs are widely used across applications for instance LCD display, cell phone display, connectivity antennas, and flexible circuitry employed in re-chargeable batteries. Growth in demand for consumer electronic wares, boost in desire for Internet of Things (IoT), and usage of FPCBs in car applications generate the market expansion. Furthermore, rise in demand for programmed robots is believed to deliver profitable chances to market competitors. Multilayer FPCBs led the FPCBs industry, and is supposed to preserve this fad all through the forecast time period. However, the rigid-flex FPCBs segment is supposed to find considerable growth in the near future, owing to the lightweight size and low power usage.

Among customer, gadgets dominated the worldwide market in the year 2015, accounting for roughly 30% share. Nonetheless, motor vehicle electronics is anticipated to increase at the maximum CAGR of 10.7%, caused by rise in desire for robust units with increased efficiency.

Asia-Pacific was the main revenue contributor in 2015, and is supposed to maintain its importance in the coming years, thanks to rise in number of electronic applications. More so, enhancements in electronic gadgets and industrial systems are estimated to increase the FPCBs market growth rate, largely in the Asian countries, for instance China, Japan, Oceania, plus India.

Flex PCBs are very efficient interconnectivity solutions utilized for a wide array of electronic gadgets with complicated circuitry. More so, they feature a good number of edges for instance high efficiency and minimized system routine maintenance. Multilayer FPCBs account for more or less 30% of the complete FPCBs market, caused by their resilience and high efficiency. Moreover, sizeable demand for electronics applications and client shift towards small sized printing to attain better efficiency are expected to fuel its adopting in the electronic gadgets, car, and other industry sectors, suggests Jeshin Jayamon, Research Expert, Semiconductor & Electronics Research, Allied Survey.

LAMEA is estimated to increase at the maximum CAGR over the analysis period, thanks to rise in lightweight appliances and increase in the adopting of FPCBs in car applications. More so, technological improvements to prevail over power loss problems in extreme conditions are estimated to supply profitable chances for market competitors anytime soon.

Significant Results Of The Flex PCB Market

In 2015, multilayer FPCBs ruled the worldwide FPCBs market, in terms of revenue, and is forecasted to increase at a CAGR of 10.7Pct all through the forecast period.

Electronic devices directed the market, accounting for nearly 30% share in the year 2015.

China was the key shareholder in the Asia-Pacific FPCBs market, accounting for about 34% in 2015.

The essential competitors running in the FPCB market make the most of new product launch as their favored strategy to extend their market foothold. The big competitors profiled in this report include NOK Corporation (Nippon Mektron Ltd.), Sumitomo Electric Industries, Ltd. (SEI), Fujikura Ltd., Multi-Fineline Electronix, Inc., Zhen Ding Technology Holding Limited (ZDT), Nitto Denko Corp., Interflex Co., Ltd., Career Technology, FLEXium Interconnect, Inc., plus ICHIA Technologies Inc.