Rigid-flex Printed Circuit Board Design Covers Wearable Healthcare Gadget Obstacles

Rigid-flex Printed Circuit Board Design Covers Wearable Healthcare Gadget Obstacles


The majority of PC boards in the world today are basically inflexible plates to connect circuitry. But, that is changing rapidly; the need for flexible circuit boards (or flexible circuits) is rapidly escalating mostly due to the flourishing wearable product industry. Probably the largest segment of that market is the medical care industry where wearable gadgets will be employed to collect all varieties of biological info for examination and study, and also individual health use. Undoubtedly wearables can be obtained to watch heart rhythm, blood pressure, glucose, ECG, muscle movement, and even more.

The wearable devices present a number of problems for circuit card designers that rigid boards do not. Here are several of such problems and what designers can perform to alleviate them.

Three-dimensional Design

While every single circuit board is actually 3 dimensional, flexible circuits enable the entire assy to be bent and folded to conform to the package that the merchandise requires. The flex circuitry is collapsed to ensure the rigid PCBs fit into the item package, taking up minimal space.
There are lots more to the design, hence the extra challenges, than simply connecting the rigid boards. Bends should be precisely designed so boards line up where they’re intended to mount, while not putting stress on the connection points. Up until recently, engineers actually used “paper doll” models to simulate the circuit card assy. Right now, design tools are available providing 3D modelling of the rigid-flex assembly, which allows faster design and a lot greater exactness.

Tiny Products and Compacted Circuits

By definition, wearable products should be tiny and unobtrusive. Up to now, a medical “wearable” such as a Holter pulse rate monitor included a fairly large exterior device with a neck strap or belt mount. The recent wearables are small and install straight away to the sufferer with no or very few external wires. They obtain an assortment of info and can even process several analyses.

An unobtrusive device mounting straight to the sufferer demands flex circuitry and really dense layouts. On top of that, the board shapes in many cases are spherical or maybe more unusual shapes, demanding creative placement and routing. For these kinds of tiny and densely-packed boards, a electronic circuit board tool that’s enhanced for rigid-flex designs helps to make addressing unconventional shapes more convenient.
Stackup Design is a must

The stackup – the map of the electronic circuit board layers – is very important when you use rigid-flex techniques. If possible, your PCB design software has the capacity to design your stackup including both the rigid and flexible parts of the assy. As mentioned earlier, the layout of the bending area needs to be designed to reduce the stresses on the traces and pads.
One of the primary obstacles with rigid-flex designs is qualifying several producers. After the design is finished, every aspect of the design have to be communicated to the board fabricator therefore it will be appropriately produced. Having said that, the best practice is to choose one or more producers at the beginning of the design and collaborate with them to be certain your design fits their assembly demands as the design gets better. Participating with manufacturers is simplified by utilizing standards. In such a case, IPC-2223 is the vehicle for making contact with your fabricators.

As soon as the design is completed, the data package is required to be assembled to hand-off to be made. Although Gerber remains utilized for standard PCBs in certain enterprises, with regards to the difficulties of rigid-flex, it is strongly advised by both PCB program providers as well as fabricators that a more intelligent data exchange format be employed. The two most famous intelligent formats are ODG++ (version 7 or higner) as well as IPC-2581, both of which precisely specify layer standards.