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Der Podcast widmet sich einem weiteren Schwerpunkt der electronica 2012: Automotive und Elektromobilität. Im Mittelpunkt stehen unter anderem neue Ladesysteme und die Vernetzung von Fahrenzeugen. Außerdem informiert der Beitrag über Fortschritte, aktuelle Entwicklungen und Entwicklungspotenziale im Automotive- und Elektromobilitätsbereich.

Der Beitrag enthält Interviews mit:
– Christoph Stoppok, Geschäftsführer der Fachverbände Electronic Components and Systems sowie PCB and Electronic Systems des ZVEI (Zentralverband der Elektrotechnik- und Elektronikindustrie)
– Ralf Bungenstock, Gruppenleiter Produktentwicklung Phoenix Contact,
– Joachim Weitzel, Infineon Technologies AG
– Norbert Hauser, Executive Vice President Marketing Kontron AG


IoT, Automotive Electronics Motivating FPCB Industry Advancement

Flexible Printed Circuit Boards Market report, created by Allied Survey, forecasts that the international market is supposed to get 27 billion dollars by the year 2022, rising at a CAGR of 10.4Pct from 2016 To 2022.

Asia-Pacific reigned over the world-wide market, as far as revenue, accounting for higher than 46% in 2015, and then North America.

FPCBs are popular across applications just like LCD display, smartphone display, connectivity antennas, and flexible circuitry used in re-chargeable batteries. Increase in need for consumer electronic items, increase in curiosity about Internet of Things (IoT), and adoption of FPCBs in automotive applications drive the market development. On top of that, surge in need for computerized bots is believed to deliver beneficial possibilities to market competitors. Multilayer FPCBs contributed the FPCBs market, and is supposed to keep this movement during the forecast time period. Even so, the rigid-flex FPCBs segment is estimated to view considerable surge in the long term, as a result of the small size and reduced power usage.

Among consumer, electronics led the world-wide market in 2015, accounting for roughly 30% market share. Having said that, car electronics is predicted to grow at the greatest CAGR of 10.7%, because of surge in demand for sturdy units with enhanced efficiency.

Asia-Pacific was the main revenue donor in 2015, and is supposed to keep up its importance in the coming years, as a consequence of surge in quantity of electronic applications. Additionally, innovations in electronic gadgets and industrial systems are estimated to boost the FPCBs market growth, mainly in the Asian countries, like China, Japan, Oceania, as well as India.

Flex PCBs are highly reliable interconnectivity solutions useful for a variety of electronic devices with intricate circuitry. Additionally, they feature a number of benefits just like high efficiency and minimized system maintenance tasks. Multilayer FPCBs account for pretty much 30% of the complete FPCBs market, owing to their resilience and high efficiency. Moreover, large need for electronics applications and consumer shift towards small sized printing to achieve better efficiency are anticipated to fuel its use in the electronic gadgets, automotive, and other market sectors, declares Jeshin Jayamon, Research Analyst, Semiconductor & Electronics Research, Allied Market Research.

LAMEA is believed to increase at the greatest CAGR all through the analysis period, as a consequence of surge in transportable appliances and increase in the use of FPCBs in automotive applications. Additionally, technological advancements to rise above power loss complications in extreme conditions are predicted to provide profitable chances for market gamers sooner.

Main Studies Of The Flex PCB Industry

In 2015, multilayer FPCBs dominated the world-wide FPCBs market, on the subject of revenue, and is projected to increase at a CAGR of 10.7Pct within the forecast period.

Consumer electronics headed the market, accounting for roughly 30% market share in 2015.

China was the leading shareholder in the Asia-Pacific FPCBs market, accounting for about 34% in 2015.

The key gamers doing business in the FPCB market make use of new product release as their favorite tactic to broaden their market foothold. The key members shown in this report include NOK Corporation (Nippon Mektron Ltd.), Sumitomo Electric Industries, Ltd. (SEI), Fujikura Ltd., Multi-Fineline Electronix, Inc., Zhen Ding Technology Holding Limited (ZDT), Nitto Denko Corp., Interflex Co., Ltd., Career Technology, FLEXium Interconnect, Inc., as well as ICHIA Technologies Inc.

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