La nuova generazione di Oscilloscopi PicoScope Automotive a 2 o 4 canali, è stata completamente rinnovata sia nell’hardware sia nel software con nuovi aggiornamenti e funzionalità. Anche il design è frutto della ricerca e del lavoro svolto in questi anni per lo sviluppo dei nuovi PicoScope 4225 e 4425.

CAMPIONAMENTI PIU’ VELOCI!

I nuovi PicoScope 4225 e 4425 offrono un campionamento fino a 400 MS/s cinque volte più veloce delle versioni precedenti. Questo permette la cattura anche dei nuovi segnali automotive di linee CAN o FlexRay contemporaneamente su tutti i canali e sono pronti per le nuove tecnologie di comunicazione che stanno sviluppando sui veicoli moderni.

ANCORA PIU’ MEMORIA!

I nuovi PicoScope 4225 e 4425 offrono una memoria da 250 milioni di campioni otto volte superiore, la precedente serie ne aveva 32 MS. Ora si può campionare alla stessa velocità senza compromettere le videate salvate e poter tornare in dietro nel buffer per analizzare i segnali precedenti. Indispensabile per chi vuole continuare a lavorare da solo senza perdere informazioni utili.

NUOVI FLOATING INPUTS

I connettori BNC di ingresso supportano fino a ±200V (riducendo così la necessità di attenuatori) con tecnologia Floating Inputs.

TECNOLOGIA ConnectDetect™

Con questa generazione di oscilloscopi si introduce anche la nuova funzione ConnectDetect ™ che indica quando si ha un “buon collegamento” sul Software.

CONNESSIONE USB 3.0 SuperSpeed

I nuovi PicoScope sono connessi e alimentati su Pc con la nuova USB 3.0 Super Speed (sempre compatibile per chi utilizza la 2.0) che vi darà un’incredibile frequenza di aggiornamento sullo schermo del vostro Pc.

SOFTWARE DEMO GRATUITA

Gli oscilloscopi PicoScope vengono forniti con due programmi inclusi, Sofware PicoDiagnostics e PicoScope completamente in italiano con oltre 190 guide di test, manuali e forme d’onda di riferimento per componenti elettrici ed elettronici automotive.

Altre info su www.pcbauto.it

IoT, Car Electronics Powering FPCB Industry Enlargement

Flexible Printed Circuit Boards Market report, created by Allied Market Research, predicts that the world-wide market is likely to gather 27 billion by the year 2022, growing at a CAGR of 10.4Percent from 2016 – 2022.

Asia-Pacific dominated the worldwide market, as to revenue, comprising upwards of 46Pct in 2015, and then North America.

FPCBs are commonly used across applications including LCD screen, handset display, connectivity antennas, and flexible circuitry applied to rechargeable batteries. Boost in demand for consumer electronic things, rise in desire for Internet of Things (IoT), and usage of FPCBs in auto applications motivate the market development. Also, increase in need for automated robots is envisioned to generate rewarding possibilities to market competitors. Multilayer FPCBs headed the FPCBs market, and is expected to retain this craze throughout the forecast period of time. Nonetheless, the rigid-flex FPCBs segment is believed to observe significant rise in the foreseeable future, due to the compact size and minimal power usage.

Among customer, consumer electronics ruled the worldwide market in the year 2015, comprising approx. 30% share. Yet, automotive electronics is anticipated to raise at the highest possible CAGR of 10.7%, because of increase in sales of durable devices with upgraded efficiency.

Asia-Pacific was the important revenue bestower in 2015, and is expected to preserve its dominance later on, owing to increase in amount of electronic applications. Besides, innovations in consumer electronics and industrial systems are anticipated to give a boost to the FPCBs market growth rate, specially in the Parts of Asia, for instance , China, Japan, Oceania, and India.

Flexible PCBs are highly productive interconnectivity solutions used in a wide range of electronic products with elaborate circuitry. Besides, they feature a good number of merits including high efficiency and decreased system maintenance tasks. Multilayer FPCBs make up more or less 30% of the full FPCBs market, on account of their resilience and high efficiency. Aside from that, substantial need for electronics applications and consumer shift towards small sized printing to get to better efficiency are anticipated to trigger its adopting in the consumer electronics, auto, as well as other industry sectors, says Jeshin Jayamon, Research Analyst, Semiconductor & Electronics Research, Allied Research.

LAMEA is projected to grow up at the highest possible CAGR during the analysis period of time, owing to increase in easily transportable appliances and increase in the adopting of FPCBs in auto applications. Besides, technological breakthroughs to get over power loss complications in extreme circumstances are anticipated to provide beneficial opportunities for market participants in the near future.

Significant Discoveries Of The Flexible Printed Circuit Boards Market

In 2015, multilayer FPCBs took over the worldwide FPCBs market, for revenue, and is estimated to grow up at a CAGR of 10.7% through the forecast period of time.

Electronic products directed the market, comprising approximately 30% share in the year 2015.

China was the primary shareholder in the Asia-Pacific FPCBs market, comprising roughly 34% in 2015.

The significant participants doing business in the FPCB market make full use of new product release as their favored strategy to increase their market foothold. The key competitors profiled in this report contain NOK Corporation (Nippon Mektron Ltd.), Sumitomo Electric Industries, Ltd. (SEI), Fujikura Ltd., Multi-Fineline Electronix, Inc., Zhen Ding Technology Holding Limited (ZDT), Nitto Denko Corp., Interflex Co., Ltd., Career Technology, FLEXium Interconnect, Inc., and ICHIA Technologies Inc.

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